Hello Everyone,

My study area is lying over multiple sub-swaths and bursts, and multiple slices (stand-alone product) of Sentinel-1 (IW acquisiton mode) data.

Concern 1: I am able to process single slice of Sentinel-1 TOPS using ISCE processor, but dont know how to perform the Slice Assembly and Merging of sub-swath of Sentinel-1 products using ISCE processor.

Concern 2: Slice assembly and merging tools are available in SNAP. If I am performing these operations in SNAP, I dont know how to read the SNAP outputs in ISCE for further processing. This I am asking because my area is large and SNAP is slow compared to ISCE.

Can anybody help me for any one concern described above?

Many thanksHari Shankar